Welcome to Akron Ascent Innovations
Akron Ascent Innovations, AAI, is a start-up company spun out from the University of Akron (UA) in 2012, under the National Science Foundation I Corps project led by Professor Shing-Chung "Josh" Wong. The Company focuses on manufacturing, testing and services of electrospun polymer adhesive technologies funded by the National Science Foundation. As nature makes use of microfibrous adhesive structures resulting in high shear and low peel, electrospun polymer blends and alloys open up new frontiers for adhesion science and manufacturing. We would love to hear from you, share with you and inspire each other!
The use of nanofibers and biomimicking adhesives offer the following characteristics:
Electrospinning is a versatile technique to fabricate nanofibers mimicking naturally occuring phenomena, with added advantages of tailoring engineered solutions to applications. Electrospinning produces solution blends that can be scaled up for adhesives manufacturing. Different formulations and fiber morphology can be achieved with additional properties such as colors, chemical, thermal and UV resistance.
The use of nanofibers and biomimicking adhesives offer the following characteristics:
- Light weight
- Removable and reusable
- No residue
- Non toxic
- Self-cleaning
- Stick to all surfaces (smooth/rough/wet/dry) and all materials (polymer/metal/paper/wood/composites)
Electrospinning is a versatile technique to fabricate nanofibers mimicking naturally occuring phenomena, with added advantages of tailoring engineered solutions to applications. Electrospinning produces solution blends that can be scaled up for adhesives manufacturing. Different formulations and fiber morphology can be achieved with additional properties such as colors, chemical, thermal and UV resistance.